METHOD FOR SOLDERING MICROCHANNEL HEAT EXCHANGER Russian patent published in 2023 - IPC B23K1/08 B23K101/14 B23K103/10 

FIELD: heat exchangers.

SUBSTANCE: used in the manufacture of heat exchangers with seamless microchannel tubes made of aluminum alloys clad with silumin. The heat exchanger parts are assembled in a production device that rigidly fixes them. After thermal degreasing of the parts in a chamber-type oven, flux and solder paste are applied to them and dried to a surface temperature of no more than 270°C. Preheat the container with the supply of inert gas, place the assembled heat exchanger in it, seal it and fill it with inert gas. Soldering is carried out in an oven preheated to a temperature of 730-740°C. Register the start time of soldering at a heat exchanger surface temperature of 610-612°C and remove the container with the heat exchanger from the furnace, and when the temperature reaches 570°C register the end of soldering. When cooling the surface of a microchannel heat exchanger to 300° the supply of inert gas is stopped and the container is cooled.

EFFECT: obtaining a high-quality soldered connection of parts made of aluminum alloys and reducing the labor intensity of manufacturing the heat exchanger.

1 cl, 2 dwg