SOLDER FOR SOLDERING ALUMINIUM AND ALLOYS THEREOF Russian patent published in 2016 - IPC B23K35/28 C22C21/02 C22C21/10 C22C21/12 

FIELD: technological processes.

SUBSTANCE: invention can be used in producing soldered structures from aluminium and its alloys. Solder contains following component ratio, wt %: silicon 5-13, copper 4-7, zinc 4-7, nickel 0.5-3, manganese 0.3-3, iron 0.3-3, at least one element from group comprising strontium 0.001-0.2; beryllium 0.001-0.1, titanium 0.001-0.1, sodium 0.001-0.2 and vanadium 0.001-0.2, rest is aluminium. Iron to manganese ratio varies from 1:1 to 1:1.1. Ratio of nickel to iron is not more than 1:2. During vacuum soldering solder additionally contains magnesium in amount of 0.1-1 wt. %. In soldering with long thermal cycle solder additionally contains, wt%: cobalt 0.001-0.8 and molybdenum 0.001-0.8.

EFFECT: low melting point of solder, higher strength and corrosion resistance of produced soldered structures from aluminium alloys, which increases their service life.

3 cl, 2 tbl, 3 ex