FIELD: electricity.
SUBSTANCE: immersion cooling system for electronic devices contains a sealed container with a dielectric cooling liquid containing electronic devices with components that produce heat; a distribution unit, distributing the dielectric cooling liquid around the container; a direction unit for supplying and removing the dielectric cooling liquid out of the container, comprising of a pump with a filter for filtering the dielectric cooling liquid; a cooling unit for cooling the dielectric cooling unit in the container by means of a secondary cooling liquid; a removal unit for filling and removing the dielectric cooling liquid out of the container. They are all installed in one housing forming a computing unit. As the distribution unit, a plate with fittings is used. It forms a sealed cavity with the bottom of the container communicating with the dielectric cooling liquid direction unit. The electronic devices are completely immersed in the dielectric cooling liquid and connected to power and switching systems through electric connectors located on the plate with fittings, guiding the dielectric cooling liquid to the most heated electronic components of the electronic devices. The computing unit is connected to the secondary cooling liquid source through the cooling unit, connected to the container, to the power supply source and to the network hub.
EFFECT: increase in the density of the layout of the electronic devices, simplification of the cooling system of electronic devices in the computing unit, increase in the maintainability, improvement of the maintenance conditions of the computing unit.
2 dwg
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Authors
Dates
2018-01-31—Published
2016-12-30—Filed