SYSTEM FOR DIRECT LIQUID COOLING OF ELECTRONIC COMPONENTS Russian patent published in 2019 - IPC G12B15/04 H05K7/20 

FIELD: physics.

SUBSTANCE: invention relates to equipment for cooling electronic components, in particular, to a system for direct liquid cooling of electronic components. Disclosed system includes a reservoir and a removable stand placed in the reservoir and providing reliable attachment of electronic components for cooling. System also includes dielectric cooling agent performing upward movement in parallel flows between electronic components and pump providing continuous supply of dielectric coolant, thereby causing the dielectric coolant to rise upward through the electronic components and causing dielectric coolant overflow inside the reservoir. Also provided is a heat exchanger connected to the tank through the outlet pipeline. In addition, there is a controller for monitoring temperature and adjusting the flow of dielectric coolant.

EFFECT: technical result is to maintain a given thermostable medium for various electronic components, as well as high reliability and efficiency of the system.

11 cl, 8 dwg