FIELD: cooling systems.
SUBSTANCE: invention relates to the field of cooling systems for electronic devices. The expected result is achieved due to the fact that the tank contains a rectangular container made with the possibility of placing a removable rack in its cavity, with electronic components installed on it for cooling, and filled with dielectric refrigerant, equipped with an inlet located at the bottom of the container with the possibility of connection through the inlet pipe with the pump, and an outlet to ensure overflow dielectric refrigerant through the exhaust pipe into the heat exchanger, while the container is made of welded stainless steel, on one of its long side walls, an overflow zone is formed for the physical separation of the ascending and outgoing flows of dielectric refrigerant, made in the form of a separated pocket, at the bottom of which there is an outlet, while the volume of the pocket is defined as the product of the surface area of the liquid dielectric refrigerant in the tank and the height of the liquid layer above the electronic components installed in the tank.
EFFECT: increase in the reliability of the immersion cooling system for electronic devices.
3 cl, 2 dwg
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Authors
Dates
2022-08-09—Published
2021-09-07—Filed