ELECTRONIC MODULES PROTECTION DEVICE Russian patent published in 2018 - IPC H01L23/02 H01L23/42 H01L23/34 H05K5/02 H05K7/20 

FIELD: heating.

SUBSTANCE: electronic modules protection device provides the protection of electronic components from the thermal overloads by a combination of design protection layers, embedded in each other. The device is a system of protective shells, with placed between them the materials of passive-semiactive and active thermal protection. The composite materials of the thermal protection in the range of temperatures values of the effecting heat flow, decompose the contained therein thermoactive substances with occluded water and carbon dioxide vapor release, which helps to active heat absorption at reaction of water molecules work up and the phase transition of water into the vapor condition.

EFFECT: increase of the allowable temperature retention time and improving the protection of electronic modules from thermal overloads.

1 dwg