HEAT SHIELD FOR ELECTRONIC MEMORY MODULE Russian patent published in 2013 - IPC G12B15/06 H01L23/34 H05K7/20 G06F1/20 

FIELD: information technology.

SUBSTANCE: heat shield for electronic memory module has a housing 1 with a cover 2 made of metal, wherein inner surfaces of the housing 1 form a compartment for accommodating at its centre an electronic memory module 3 with a connecting cable 4, a passive heat insulation layer adjoining the inner surface of the housing 1 and being in form of cup 5 with a cover 6, an active heat insulation shell made from a composite mixture in form of a detachable component, wherein the active heat insulation shell consists of a housing 7 having inside it the electronic memory module 3 and a cover 8, joined to each other by surfaces having the shape of a flattened cone, wherein the housing 7 and the cover 8 of the active heat insulation shell are in sealed packaging 9, 10 made from polyethylene, for protecting the inner surface and from aluminium foiled-coated polyethylene for protecting the outer surface of the active heat insulation shell.

EFFECT: design of a novel heat shield for an electronic memory module which improves performance in emergency situations by keeping the electronic memory module in an allowable temperature range for the required period of time.

6 cl, 2 dwg