FIELD: thermophysics.
SUBSTANCE: thermal protection device is intended for thermal protection of electronic modules in emergency conditions, which includes metal protective housing with the following layers successively layered inside it: a layer of thermal insulating material and a layer of heat-absorbing waxen material that surround the protected electronic module; said device is additionally equipped with a layer of intumescent material applied to the protective housing from outside, and said layer of heat-absorbing material is made of organic substance from the following group: fatty acids or fatty acids mix or paraffins or natural waxes or naphthalene with melting point in the range of 60-90°С.
EFFECT: improvement of electronic modules thermal protection reliability due to decrease of maximum temperature inside the housing when operating in emergency conditions as well as improvement of device repairability and producibility.
13 cl, 3 dwg
