FIELD: electronics.
SUBSTANCE: printer 3D and a method of dosing a material to form a volumetric substructure and dosing an adhesive onto a bulk substructure are suggested. Adhesive applied to the bulk substructure, can be used to connect a volumetric substructure with another substructure, such as a normally formed substructure or other voluminous printed substructure. Application of an adhesive with using a voluminous printer during the same bulk forming process for printing a bulky sub-structure can improve the accuracy of site selection, where the adhesive is dosed, and thus improve the quality of the overall construction, created by connecting substructures.
EFFECT: embodiment of the present invention can reduce the total time and cost of joining substructures.
7 cl, 7 dwg
