FIELD: chemistry.
SUBSTANCE: invention relates to a solder mask ink composition. Solder mask ink composition contains an epoxy resin, a solvent in an amount of at least 20 % by weight of the total weight of the composition, and a non-ionic surfactant. Ink composition has a viscosity of less than 1,000 cP at a shear rate of 10 s.-1 and more than 100 cP at a shear rate of 495 s-1 and at a temperature of 25 °C. Solvent is selected from a group consisting of dialkylene glycol monoalkyl ether, alkoxybenzene, C5-C8 alcohol and C2-C4 alkanediol. Solvent is characterised by a boiling point of at least 135 °C at atmospheric pressure. Non-ionic surfactant is polyethylene glycol-block-polypropylene glycol-block-polyethylene glycol.
EFFECT: providing a solder mask composition which can be applied using an inkjet printing method.
9 cl, 6 dwg, 1 tbl, 5 ex
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