FIELD: cooling.
SUBSTANCE: invention relates to the heat dissipation module, in particular to the heat dissipation module with preferred heat dissipation efficiency, video card unit, and electronic device using the heat dissipation module. Achieved by the fact that the heat dissipation module contains set of radiators, first fan and second fan, closely located to each other on the set of radiators. Projection of the area covered by first fan during rotation to the plane, where the radiator set is located, is partially overlaps with the projection of the area covered by the second fan during rotation to the plane, where the radiator set is located. First fan rotation direction is different from the second fan rotation direction. Also proposed is a video card unit containing video card and the aforementioned heat dissipation module. Also proposed is electronic device containing motherboard and the aforementioned video card unit.
EFFECT: development of the heat dissipation module capable to provide the preferred heat dissipation efficiency and having smaller thickness.
8 cl, 4 dwg
