FIELD: chemistry.
SUBSTANCE: invention relates to an adhesive composition with reduced boron content or non-boron content and its use in the manufacture of corrugated cardboard. Adhesive composition comprises starch, an additive composition, a filler. Additive composition includes polyphosphate and hydrocolloid.
EFFECT: invention makes it possible to obtain an adhesive composition that does not contain boron.
15 cl
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