FIELD: electrical engineering.
SUBSTANCE: invention relates to electrical engineering and can be used to dissipate heat for an optical module. Device comprises a guide rail, wherein the guide rail is set on a circuit board for accommodating the optical module, the guide rail being covered with a heat conduction block, heat dissipation teeth are formed on a part of areas on the heat conduction block, the heat dissipation teeth are positioned at a rear portion of the guide rails, the heat dissipation teeth extend in a direction close to the circuit board, so that the heat dissipation teeth and the guide rails are positioned at the same side of the heat conduction block.
EFFECT: technical result consists in ensuring the efficiency of heat dissipation by the thermal conductivity of the heat conduction block and the dissipation of heat by heat dissipating teeth.
10 cl, 11 dwg
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Authors
Dates
2018-10-11—Published
2014-09-15—Filed