FIELD: various technological processes.
SUBSTANCE: invention relates to device for glue dispensing and workpiece fixation and can be used for processing of microcircuits. Device comprises two loading and unloading mechanisms (1), wherein the workpiece is movable between two loading and unloading mechanisms (1), two-valve asynchronous device (2) for dispensing an adhesive; device (3) for fixation of heat-dissipating casing and device (4) for hot pressing. Two-valve asynchronous device (2) for dispensing glue, device (3) for fixation heat dissipating casing and device (4) for hot pressing are sequentially located between the above two mechanisms (1) of loading and unloading along the direction of movement of the workpiece.
EFFECT: ensuring continuous production throughout the entire workpiece processing process.
20 cl, 47 dwg
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