FIELD: technological processes.
SUBSTANCE: invention relates to regeneration of etching solution of copper chloride and can be used in the manufacture of printed circuit boards. Method of regeneration of copper-chloride pickling solution containing 70–200 g/l of copper ions and 75–90 g/l of hydrogen chloride, includes electrochemical treatment of copper chloride pickling solution at a temperature of 25–50 °C on titanium cathode in cathode chamber, separated by cation-exchange membrane from the anode chamber with solution of sulfuric acid and platinized titanium anode connected to current source. Moreover, after treatment in cathode chamber, pickling solution is poured into additional anode chamber separated from mentioned cathode chamber by cation-exchange membrane with platinized titanium anode connected to additional current source. When this pickling solution is treated in cathode chamber at a cathode current density of 2–10 A/dm2, and in the main anode chamber anode current density is 1–5 A/dm2, and in additional anode chamber – 0.1–0.5 A/dm2.
EFFECT: invention allows to eliminate chlorine emissions at the anode and provides regenerated pickling solution with content of monovalent copper ions not exceeding 10 % of total copper content, as well as reducing specific energy consumption.
1 cl, 3 ex
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Authors
Dates
2019-01-17—Published
2018-02-16—Filed