FIELD: electronic equipment.
SUBSTANCE: invention relates to electronics and electroplating and can be used for making solid-state devices based on magnetostrictive effect. Method includes degreasing plates of lead zirconate-titanate (ZT) or gallium arsenide in boiling acetone, etching in diluted hydrochloric acid solution, washing in deionised water, drying, sputtering on said plates multilayer coating, annealing, contacting, degreasing, etching of upper sputtered layers of multilayer coating, pickling, washing and nickel plating, characterized in that before nickel plating is applied by galvanic tin layer using electrolyte at the following ratio of components, g/l: tin of sulfuric acid 40–80, sulfuric acid 100–120, preparation OS-20 4–5, at cathode current density 1–2.5 A/dm2 and one-minute current shock, which exceeds working current density twice, and then carry out the electrodeposition nickel layer from sulphate electrolyte having temperature of 50–70 °C, at cathode current density of 0.5–1.5 A/dm2, then these layers of coating alternate, wherein the thickness of one layer of nickel is 18–20 mcm, and thickness of one layer of tin is not less than 6–8 mcm, while content of nickel in multilayer coating is not more than 65–66 %.
EFFECT: high magnetoelectric effect of the formed structures, high adhesion of coatings to gallium arsenide and LCC, plasticity of coatings, low internal stresses of coatings and high quality thereof.
3 cl, 2 tbl, 3 ex, 2 dwg
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Authors
Dates
2019-03-19—Published
2017-12-05—Filed