FIELD: technological processes.
SUBSTANCE: invention relates to devices for soldering or unsoldering components, preferably integrated circuits on printed circuit board, using laser energy. Housing of the heating tip is shaped as a socket. At least two waveguides are arranged at its lower part along its perimeter. Housing has double walls to transmit laser power from external source to said waveguides. Waveguides have inlet holes for supply of laser energy and outlet holes for its transfer in direction of solder balls. Number of outlet holes corresponds to number of soldered outputs of components.
EFFECT: device provides for uniform soldering and unsoldering components, including in BGA case, on all contact sites with elimination of component move or slant during soldering, which could lead to cracks in soldered joint.
4 cl, 3 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| SOLDERING/UNSOLDERING DEVICE | 1997 |
|
RU2179098C2 |
| ELECTRONIC BOARD WITH BUILT-IN HEATING RESISTANCE | 2008 |
|
RU2484607C2 |
| METHOD FOR VACUUM SOLDERING SOLDER BALLS TO LEADING PLATFORMS OF CERAMIC METAL CASES OF MATRIX TYPE | 2022 |
|
RU2812158C1 |
| CONNECTOR DISTINGUISHED BY HIGH-DENSITY DISPOSITION OF COMPONENTS AND ITS MANUFACTURING PROCESS | 1997 |
|
RU2208279C2 |
| CONTACT ASSEMBLY ON OPPOSITE CONTACTS WITH CAPILLARY CONNECTION ELEMENT, AND MANUFACTURING METHOD THEREOF | 2008 |
|
RU2374793C2 |
| PRINTED BOARD AND METHOD FOR PRODUCTION THEREOF | 2014 |
|
RU2685692C2 |
| 0 |
|
SU459874A1 | |
| HALOGEN-HYDROCARBON POLYMER COATING | 2009 |
|
RU2533162C2 |
| "DEVICE FOR DISMOUNTING INTEGRATED CIRCUITS FROM PRINTED-CIRCUIT BOARD | 0 |
|
SU868892A1 |
| METHOD OF INSULATION FOR MOUNTING OF FLIP CHIPS | 2016 |
|
RU2648311C2 |
