METHOD OF INSULATION FOR MOUNTING OF FLIP CHIPS Russian patent published in 2018 - IPC H01L23/02 

FIELD: electrical engineering.

SUBSTANCE: use: for assembling three-dimensional integrated circuits (ICs) of 3D BIS. Invention consists in the fact that the insulation method for flip chips mounting includes an assembly, on which crystals with contact columns and substrates with metallization on contact areas from solder of a given thickness arrive, an adhesive tape is placed between the crystal and the substrate, having holes, the pattern of which is a mirror image of the arrangement of the contact columns on the crystal, when assembled, the contact posts of the crystal through the holes in the tape are combined with the solder of the contact pads on the substrate, then the brazing is carried out in a vacuum, when heated to the soldering temperature and the pressure on the crystal, the solder is melted, thus, the soldering of the entire surface of the contact columns of the crystal takes place, as a result of which the gap between the contact posts and the holes in the adhesive tape is filled, and since the thickness of the tape is commensurable with the distance between the crystal and the substrate, then under pressure of the crystal and at the soldering temperature, a tight banding of the tape occurs with the surfaces of the crystal and the substrate, which eliminates not only the spreading of solder on the surfaces of the crystal and the substrate and a short circuit between the contacts of the device, but also the formation of pores on the border of the tape with the soldered surfaces of the crystal and substrate.

EFFECT: technical result: providing the possibility of increasing the heat dissipation from the crystal to the substrate.

4 cl, 2 dwg