FIELD: cooling.
SUBSTANCE: invention relates to a cooling system for server cabinets, is intended to remove heat from electronic components of high-performance servers and can be used in data processing centers (DPC), at enterprises, in offices of firms, in domestic conditions both inside server cabinets and outside them. Two-phase contactless cooling system of electronic components comprises water blocks with heat carrier heated by the cooling object to form a mixture of liquid and vapor phases, and a condenser which is equipped with a phase separation tank with an inclined condensation plate, the outer surface of which is finned and covered with a casing limiting the air flow cavity along this surface, created by the fans mounted on the casing. Besides, the reservoir is connected by a system of supply and discharge heat carrier supply and discharge connection pipes, which are closed and isolated from the environment, through the corresponding headers with a water block with forced movement of the liquid heat carrier pump.
EFFECT: high efficiency of removing heat from heated electronic components and providing uniform cooling of components in the absence of direct contact of heat carrier with electronic components and arrangement of the entire system inside standard 19-inch floor-standing server cabinet.
1 cl, 2 dwg
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Authors
Dates
2019-11-19—Published
2019-05-21—Filed