FIELD: manufacturing technology.
SUBSTANCE: present invention relates to a composition for producing a thermosetting two-component epoxy resin system. Composition includes a first component containing 30–40 wt% of epoxy resin based on the total weight of the first component, taken as 100 %, and a second component located separately from the first component, wherein the second component contains 10–30 wt% of a homopolymerization catalyst and 70–90 wt% of a reactive diluent based on the total weight of the second component, taken as 100 %. Invention also discloses use of the composition as a sealing resin and a mixture for the composition.
EFFECT: disclosed composition does not contain an acid anhydride as a curing agent and has good stability during storage.
10 cl, 1 dwg, 2 tbl, 2 ex
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