FIELD: test equipment.
SUBSTANCE: test system (1) for monitoring electrical connections, in particular soldered joints, between electronic elements with controlled printed circuit board (6) is characterized by that it comprises communication interface (5), which by contacting printed circuit board (6) enables to exchange data with data memory (10) and/or communication module (9) of the monitored printed circuit board (6), wherein communication interface (5) is located inside housing (1a) of test system (1) freely movable in at least two, preferably three spatial directions (x, y, z).
EFFECT: technical result consists in provision of functional control of tracks of data of test system by means of said test system.
22 cl, 13 dwg
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