FIELD: physics.
SUBSTANCE: disclosed is test system (1) for monitoring electrical connections, in particular soldered joints, between electronic elements with a controlled printed circuit board (6), comprising a unit movably mounted in its housing (1a) and a current and/or voltage source (14) for powering a controlled printed-circuit board (6), wherein current and/or voltage source (14) is located inside housing (1a) of test system (1) movably in at least two spatial directions.
EFFECT: technical result when implementing the declared solution is creation of a test system responding extremely fast to varying loads on a controlled printed circuit board, which occur when data is exchanged between a data storage device and a communication interface.
8 cl, 13 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| TEST SYSTEM FOR MONITORING ELECTRONIC CONNECTIONS OF ELEMENTS WITH PRINTED CIRCUIT BOARD | 2017 |
|
RU2713102C1 |
| TEST SYSTEM FOR MONITORING ELECTRONIC CONNECTIONS OF ELEMENTS WITH PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD | 2017 |
|
RU2712983C1 |
| PRINTED-CIRCUIT BOARD WITH CONTACT DEVICE | 2017 |
|
RU2719303C1 |
| ELECTRONIC CONNECTION MONITORING TEST SYSTEM | 2017 |
|
RU2717361C1 |
| TRADING SYSTEM | 2015 |
|
RU2702263C2 |
| RELAY PROTECTION AND CONTROL DEVICE (VERSIONS) | 2015 |
|
RU2615138C1 |
| SYSTEM FOR FUNCTIONING TESTS AND BURN-IN TESTING OF DIGITAL INTEGRATED CIRCUITS (IC) AND VERY LARGE SCALE INTEGRATED CIRCUITS (VLSIC) | 2011 |
|
RU2485529C1 |
| DEVICE FOR PARAMETRIC CONTROL OF MULTI-LAYER ELECTRONIC BOARDS | 2003 |
|
RU2256187C1 |
| POWER SUPPLY MODULE FOR MODULAR TELECONTROL EQUIPMENT AND EQUIPMENT COMPRISING SAME | 2015 |
|
RU2680591C2 |
| STAND FOR STUDYING MICROCONTROLLER CONTROL SYSTEMS | 2008 |
|
RU2402822C2 |
