FIELD: printing.
SUBSTANCE: method is provided for formation of a printing head for thermographic jet printing, which includes at least the following stages: providing a semiconductor plate comprising an integrated electronic circuit and a section for forming a thermal drive element, wherein the integrated circuit comprises at least: a heat-insulating layer formed over the substrate; and first metal layer formed above heat-insulating layer; wherein first metal layer passes into section for formation of thermal drive element; and section etching to form thermal drive element to first metal layer, so that first metal layer acts as etching preventing layer. Besides, a printing head for thermographic jet printing is provided, which is formed by means of the method according to the present invention, and a semiconductor plate for formation of printing heads for thermographic jet printing by means of the method according to the present invention.
EFFECT: method of forming a printing head for thermographic inkjet printing, a printing head for thermographic inkjet printing and a semiconductor wafer are disclosed.
11 cl, 21 dwg
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Authors
Dates
2020-02-18—Published
2016-10-19—Filed