COOLING METHOD OF SOLID-STATE RELAY Russian patent published in 2020 - IPC H01H45/12 H01H50/12 H01L23/373 

FIELD: electrical engineering.

SUBSTANCE: invention relates to electronics and is intended for heat removal from solid-state relays. This is achieved by the fact that the solid-state relay is placed in blind-groove cavity 2 filled with a tile glue or mortar, previously made in the outer wall of the building with its inner 1 or outer 7 side, with further application on this recess 2 additional layer of glue or mortar 3, eliminating the presence of voids between metal housing of solid-state relay 4 and internal surface of recess and protrusion of housing elements above surface of wall. At that power and control wires 5 of solid-state relay 4 are protruding from the wall on its inner side. In case of arrangement of solid-state relay in recess made from external side 7 of external wall, output of power and control wires 5 to inner part of building is performed via through channel 6, preliminary made inside external wall and connecting this cavity 4 with inner surface 1 of wall.

EFFECT: technical result is creation of reliable and efficient method of cooling solid-state relay.

1 cl, 2 dwg, 1 tbl