FLEXIBLE PACKAGING SUBSTRATES CONTAINING HEAT-RESISTANT PRINTS Russian patent published in 2020 - IPC B41M7/00 G03G13/20 

FIELD: packaging industry.

SUBSTANCE: invention relates to flexible packaging in the form of thin-film or foil materials. Disclosed is a flexible packaging substrate comprising one or more electron-crosslinkable layers of ink deposited by digital printing, wherein concentration of ethylene-unsaturated groups and alicyclic epoxides in said layers of ink is less than 0.05 meq/g, preferably less than 0.03 meq/g, more preferably less than 0.01 meq/g, most preferably less than 0.005 meq/g, wherein the cross-linked ink layers are an upper surface of said flexible packaging substrate. Method of producing a printed flexible packaging substrate involves the following steps: a) obtaining a flexible packaging substrate; b) applying at least one digital print by digital printing of at least one ink composition having concentration of ethylene-unsaturated groups, preferably (meth)acrylic double bonds, and the concentration of alicyclic epoxides is less than 0.2 meq/g, preferably less than 0.1 meq/g, more preferably less than 0.05 meq/g, most preferably less than 0.01 meq/g; c) irradiating a digital imprint with an electron beam.

EFFECT: technical result is higher efficiency and flexibility of production processes, as well as reduced time for readjustment of equipment.

20 cl