FIELD: chemistry.
SUBSTANCE: disclosed is heat-curable at low temperature adhesive composition for structures, as well as a method of producing automotive structure using an adhesive composition. Heat-curable at low temperature adhesive composition for structures contains (A) epoxy resin, (B) encapsulated in microcapsules curing agent, (C) hygroscopic agent, (D) viscosity modifier and (E) stabilizer. Hygroscopic agent (C) is calcium oxide, viscosity modifier (D) is silicon dioxide, stabilizer (E) is borate ester. Hardening is carried out at temperature from 130 to 170 °C.
EFFECT: invention provides heat-curable adhesive composition with high adhesion capacity, good viscosity at initial stage and after storage, resistance to sprayer effect, manufacturability and can prevent occurrence of flaw defects and swelling after standing in open form.
4 cl, 4 ex, 2 tbl, 2 dwg
| Title | Year | Author | Number |
|---|---|---|---|
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|
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|
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| POLYESTER HYBRID EPOXY CURING AGENTS | 2012 |
|
RU2564664C2 |
