FIELD: curing agents for epoxy resins.
SUBSTANCE: disclosed is use of an epoxy resin composition containing at least one reaction product of at least one amine of formula (I) with at least one carbonyl compound of formula (II) and hydrogen, as primer or cold curing adhesive. Invention also discloses corresponding primer, adhesive and laminar structure containing said primer. Invention also discloses a method of applying a coating on a porous mineral substrate and a method for gluing a substrate using said adhesive. Disclosed primer has low viscosity and is especially suitable for priming porous mineral substrates.
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EFFECT: technical result is that the disclosed primers and adhesives are quickly and freely cured at ambient temperature, even at low temperatures, such as 10 °C or 5 °C, virtually no yellowing, and also do not contain toxic phenol compounds, such as phenol, tert-butylphenol or nonylphenol.
15 cl, 5 tbl, 25 ex
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