FIELD: cooling.
SUBSTANCE: proposed invention relates to cooling systems of electronic system by means of liquid heat carrier. Electronic system cooling system consists of: housing partially filled with liquid heat carrier, and radiator-cooler, wherein at least one fuel element electronically controlled cooling element is partially immersed into liquid heat carrier; removal of heat from said element is carried out by forming vapors, supplied to radiator-cooler; condensate of heat carrier is supplied to part of said element not immersed into heat carrier and flows along it for cooling of all said element, wherein separation of heat carrier fluid flows and condensate flow is performed.
EFFECT: technical result is a simpler design and higher efficiency of heat exchange and reduced amount of required heat carrier.
1 cl, 2 dwg
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Authors
Dates
2020-09-02—Published
2018-08-14—Filed