COOLING SYSTEM FOR COMPUTING PLATFORM ELECTRONIC COMPONENTS AND METHOD FOR COOLING COMPUTING PLATFORM ELECTRONIC COMPONENTS Russian patent published in 2023 - IPC G06F1/20 G12B15/02 F25B21/02 

FIELD: computer engineering.

SUBSTANCE: technical result is to reduce the noise level, the volume of structural elements and energy consumption during cooling. The technical result is achieved due to the fact that a sealed case is used to cool the electronic components of the computing platform, in which the computing platform is installed in a sealed circuit filled with a coolant, which is used as a refrigerant with a heat capacity greater than the heat capacity of air, and a boiling point of which is 40°C, 45°C, 50°C, 55°C, 60°C, while the computing platform is installed in a sealed circuit completely immersed in the refrigerant, a temperature sensor is placed inside the sealed circuit, a Peltier controller is installed outside, to carry out the condensation of steam, which is obtained when the refrigerant changes from a liquid state to a gaseous state, a lower radiator is used, by means of which the coolant obtained by condensation is returned to a sealed circuit for reuse, and the heated side of the Peltier element is cooled by an upper radiator.

EFFECT: reduction of the noise level, the volume of structural elements and energy consumption during cooling.

2 cl, 1 dwg