FIELD: electrically conductive connections.
SUBSTANCE: invention relates to design of printed circuit boards, particularly to methods for routing thereof. The technical result is achieved by the fact that in the method for routing printed conductors of circuits with redundancy, including routing conductors of redundant and reserved circuits with a reference conductor as a separate layer, the redundant and the reserved conductors are laid in pairs, parallel to each other, on one layer, with a minimum technologically acceptable gap between the redundant and the reserved conductors. The printed circuit board is formed by two layers of a dielectric, wherein pairs of segments of the redundant and the reserved conductors are routed on the outer side of one of said layers and between said layers. The segments of each of the redundant and the reserved conductors located on the outer and the inner layers of the printed circuit board form the structure of a connected line. The part occupied by the length of the segments of the redundant and the reserved conductors located on the outer layer of the two-layered printed circuit board of the total length of the structure of the connected line is determined by the ratio: l1/(l1+l2), wherein l1 is the length of the segments of the redundant and the reserved conductors located on the outer layer of the two-layered printed circuit board, l2 is the length of the segments of the redundant and the reserved conductors located in the inner layer of the two-layered printed circuit board.
EFFECT: reduced susceptibility of a redundant circuit to external conductive emissions and the reduced level of conductive emissions from the redundant circuit with a possibility of two-layered routing.
1 cl, 4 dwg
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Authors
Dates
2021-07-23—Published
2020-07-06—Filed