METHOD FOR ARRANGING MULTILAYER PCB FOR REDUNDANT CIRCUITS Russian patent published in 2021 - IPC H05K3/00 H04B15/02 

FIELD: design of printed circuit boards.

SUBSTANCE: invention relates to the design of printed circuit boards (PCBs), specifically to their arranging. In the PCB arranging method, which includes the mutual arrangement of the redundant and reserve cards, the arranging and routing of the redundant and reserve cards such that the reference conductor is made in the form of separate layers on the redundant and reserve cards, the redundant and reserve cards are glued together with a dielectric layer. Each of the redundant and reserve cards is made of two dielectric layers, on the outside of one of which and inside of which are traced sections of the redundant and reserve conductors, forming structures of connected lines. When the redundant and reserve cards are glued, a multilayer PCB is formed, in which the sections of the reserved and reserve conductors located on the outer sides of one of the dielectric layers of the redundant and reserve cards are located parallel and under each other in the adhesive dielectric layer. The layers of the reference conductor are located on the opposite outer sides of the redundant and reserve cards and form the outer sides of the multilayer PCB.

EFFECT: reducing the susceptibility of the redundant circuit to external conducted emissions and reducing the level of conducted emissions from the redundant circuit with the possibility of routing in a multilayer PCB.

1 cl, 3 dwg