METHOD OF ASSEMBLING NON-MOLDED RADIOELECTRONIC COMPONENTS ON PRINTED CIRCUIT BOARDS FOR CIRCUITS WITH REDUNDANCY Russian patent published in 2019 - IPC H04B15/02 

FIELD: physics.

SUBSTANCE: invention relates to methods of redundancy, layout and routing of printed circuit boards (PCB). Method is achieved by the method of assembling of unshaped radio-electronic components (RC) on PCB for chains with redundancy includes mutual arrangement of redundant and backup circuits, layout and routing of redundant and backup boards, when reference conductor is made in form of separate layers on reserved and backup boards. Redundant and backup boards are glued with dielectric layer with relative dielectric permeability higher than that of dielectric substrates of reserved and backup boards, corresponding to each other routes of redundant and backup circuits are arranged in parallel and one under another in dielectric adhesive layer. Redundant and standby RC are arranged on opposite sides of the reserved and standby PCB to be glued, at that, the outputs of the redundant RCs are formed in one direction relative to the plane of their housing, and the backup ones in the opposite direction, and corresponding to each other reserved and standby RC are arranged one under another.

EFFECT: technical result is reduced susceptibility of redundant circuit to external conductive emissions and reduced level of conductive emissions from redundant circuit.

1 cl, 5 dwg