FIELD: material engineering.
SUBSTANCE: present invention relates to a heat-resistant film adhesive. The heat-resistant film adhesive contains a reinforcing filler with a polymer base applied to it. The polymer base is an imide-forming mixture comprising at least one dialkoxyester of tetracarboxylic acid, monoalkoxy ester of 5-norbornene-endo-2,3–dicarboxylic acid, at least one aromatic diamine, at least one aliphatic alcohol as a solvent, with the following molar ratio of the components of the imide-forming mixture: dialkoxyester of tetracarboxylic acid - n, monoalkoxy ester of 5-norbornene-endo-2,3- dicarboxylic acid 2, aromatic diamine n+1, where n is 1-4. The concentration of the imide-forming mixture is 96-98, wt. %. The reinforcing filler is a non-woven glass wool with a surface density of 20-35 g/m2. The polymer base is applied to the reinforcing filler by the melt method.
EFFECT: creation of a technologically heat-resistant film adhesive having a high glass transition temperature of 303-352°C, high strength characteristics of the cured adhesive compound: shear strength at 20°C is 19-23 MPa, while maintaining a high level of shear strength at 250°C, 15-19 MPa and at 320°, 10-14 MPa, while the surface density of the film adhesive is 250-350 g/m2.
3 cl, 2 tbl, 7 ex
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Authors
Dates
2021-11-22—Published
2021-04-01—Filed