FIELD: material processing.
SUBSTANCE: invention relates to molding mass for the production of single-layer or multilayer hollow profiles. Mass contains at least 50% by weight of a semi-crystal polyamide component and contains a filler, which impacts on electroconductivity of molding mass. At the same time, mass is characterized by that molding mass is not characterized by a temperature of crystallite melting (Tm) of less than 50°C, where the polyamide component contains components A and B: A is homopolymer PA of PA X.Y or PA Z type, where X is a diamine residue (DA), Y is a dicarboxylic residue (DC), and Z is an alpha-, omega-amino acid residue; B is copolymer PA of PA X‘Y‘ type, where X‘ is a diamine residue (DA‘), and Y‘ is a dicarboxylic residue (DC‘); where some of diamine residues (DA‘) are substituted with polyester having at least two amino ends or at least two hydroxy ends; where the fraction of polyester in the sum of components A and B is from 0.5% to 15% by weight, and where the fraction of the filler is from 2.5% to 6% by weight per the total weight of the polyamide component and the filler; where no more than 10 mol.% of diamine residues (DA‘) can be substituted with polyester having only one amino end or only one hydroxy end; where copolymer PA of the component B is characterized by a polyester content from 8% to 18% by weight per the total weight of copolymer PA. The invention also relates to the use of molding mass for the production of hollow profiles, single-layer hollow profiles, multilayer hollow profiles, as well as a method for the production of mass.
EFFECT: proposed invention provides electroconductive molding masses, which do not require any plasticizers with low molecular weight or other extracted substances for improvement of mechanical properties and increase in aging resistance.
14 cl, 6 tbl, 5 ex
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MULTILAYER COMPOSITE MATERIAL | 2005 |
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SYNTHETIC INTESTINAL CASING OF POLYAMIDE WITH NANO-DISPERSED ADDITIVES | 2000 |
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RU2518776C1 |
POLYAMIDE RESIN COMPOSITION | 2011 |
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RU2572983C2 |
MULTILAYER STRUCTURE | 2014 |
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RU2647030C2 |
POLYMER COMPOSITION | 1991 |
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RU2066681C1 |
POLYAMIDE MOULDING COMPOSITION AND METHOD OF PRODUCING MULTILAYER COMPOSITE MATERIAL USING POLYAMIDE MOULDING COMPOSITION | 2006 |
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Authors
Dates
2022-11-08—Published
2019-10-17—Filed