FIELD: electronics.
SUBSTANCE: invention can be used to provide the required temperature conditions for elements of electronic equipment (EE). The main and additional sections of the TEB, electrically connected in series are in thermal contact with the main heat exchanger by with their heat-generating junctions, which is a hollow all-metal container filled with a melting substance with a high melting heat and a melting temperature in the range of 35-55°C, with protrusions along the edges, the area of which corresponds to the area of additional sections of the TEB, while in the main heat exchanger in the horizontal direction there are through cylindrical air ducts located in the hall order, which are tubes made of highly thermally conductive material, the upper of which are in height below the level of the surface of the recess , in which the EE element is located, at a distance of 2 mm from it. A temperature sensor is installed in direct contact with the EE, connected to the main and additional sections of the TEB, two fan units are installed on the sides of the main heat exchanger, powered by an electric power source, which blow air through cylindrical air ducts.
EFFECT: increasing the efficiency of heat removal from the EE element by increasing the intensity of heat removal from the heat-generating junctions of the thermoelectric battery (TEB) sections through the main heat exchanger due forced air heat removal from it, whereas the device comprises the main section of the TEB located in the centre, and two additional sections of the TEB located at the edges.
1 cl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2796626C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2797034C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2800004C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2796624C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2800002C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM RADIOELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2800231C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2797712C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM RADIOELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2800230C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2799496C1 |
THERMOELECTRIC DEVICE FOR HEAT REMOVAL FROM ELECTRONIC EQUIPMENT ELEMENTS | 2023 |
|
RU2796631C1 |
Authors
Dates
2023-05-29—Published
2023-01-31—Filed