METHOD FOR CONTACTLESS MEASUREMENT OF THE TEMPERATURE FIELD ON THE SURFACE OF A RADIO ELECTRONIC DEVICE PRINTED BOARD Russian patent published in 2023 - IPC G01N25/52 G01J5/802 G01J5/60 

FIELD: thermophysical measurements.

SUBSTANCE: invention relates can be used for non-contact measurement of the temperature field on the surface of an object, in particular a printed circuit board of a radio electronic device. When implementing a method for measuring the temperature field on the surface of a printed circuit board of a radio-electronic device, according to which an isothermal mode with a minimum temperature T_min of the board operation is set in a chamber with a planarly placed board and a model of a blackbody (BB), and the emissivity field of the board surface is determined at a minimum temperature T_min of the board operation, for which the radiation intensity I_min and I_0min of each pixel of the thermal portrait of the board and the blackbody model are successively measured, respectively, and the value of the emissivity ε_min is calculated for each pixel of the thermal portrait of the board, isothermal mode is set in the chamber with a planarly placed board and a blackbody model with a maximum temperature T_max of the board operation and the emissivity field of the board surface is determined at the maximum temperature T_max of the board operation, for which the radiation intensity I_max and I_0max is successively measured for each pixel of the thermal portrait of the board and the blackbody model, respectively, and the value of the emissivity ε_max is calculated for each pixel of the thermal portrait of the board, the average value between ε_min and ε_max is determined by the temperature-average emissivity field ε of the board surface. Next, a calibration characteristic is formed according to the blackbody model under the conditions of measuring the temperature field on the surface of the printed circuit board and the dependence is obtained of the radiation intensity I₀ of the blackbody model on its temperature T₀, the nominal energy-stable operating mode of the board is set, the radiation intensity I of each pixel of the thermal portrait of the board is measured, the radiation field is left for the temperature field T along the surface of the printed circuit board of the electronic device.

EFFECT: expanding the scope and increasing the accuracy of non-contact measurement of temperature fields (distributions) on the surface of an object with complex temperature distribution reliefs.

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