FIELD: electroplating.
SUBSTANCE: invention relates to the copper-plating electrolytes used for applying copper coatings from aqueous solutions of copper salts on various products, mainly on products of the radio-electronic industry. Copper plating electrolyte comprises copper sulphate, sulfuric acid, OS-20 preparation, whereas it also comprises copper dichloride and hydroxyethylidene diphosphonic acid in the following ratio, g/l: copper sulphate 220-240; sulfuric acid 50-70; copper dichloride 0.03-0.095; OS-20 preparation 0.05-0.1; hydroxyethylidene diphosphonic acid 2-4.
EFFECT: improved copper-plating quality.
8 cl, 2 tbl, 8 ex
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