ELECTROLYTE FOR ELECTROLYTIC DEPOSITION OF COPPER Russian patent published in 2018 - IPC C25D3/38 

FIELD: technological processes.

SUBSTANCE: invention relates to the field of electroplating, in particular to electrochemical copper plating of metal products, and can be used in aircraft and shipbuilding, automotive, machine tool construction. Electrolyte contains the following, in g/l: copper (II) sulfate five-water 3–35; oxyethylidenediphosphonic acid 40–310; 2-amino-1-butanol 0.1–2.0; the product of synthesis of silicon dioxide and tetramethylammonium hydroxide in a molar ratio of 1:(1–7) 0.05–1; water – the rest.

EFFECT: obtaining fine-crystalline, smooth, brilliant copper coatings on products made of steel, aluminum, zinc and copper alloys in an extended range of temperatures and current densities.

1 cl, 4 ex