FIELD: electroplating processes and equipment, electroforming, shaping and other processes for applying thick- layer copper coatings. SUBSTANCE: copper plating electrolyte containing copper sulphamite, sulphamic acid and surface active matter includes as surface active matter 1-hydroxyethan-1,1-diphosphonic acid or its soluble compound at concentration 5•10-4-5•10-2 mol/l. Such surface-active matter does not decompose in electrolyte that is why correction of content of copper plating electrolyte is not necessary. EFFECT: enhanced manufacturability of process, improved quality of smooth semi-bright copper coating of significant thickness. 5 cl
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