FIELD: chemistry.
SUBSTANCE: invention relates to adhesive materials containing phenolic resins, and more specifically to the use of an adhesive material to increase the heat resistance of a substrate associated with the adhesive material. The adhesive material contains the following: (i) 1 part by weight of phenolic resin; (ii) 2 to 4 parts by weight of transition metal hydroxide and/or aluminum hydroxide; and (iii) 0.2 to 1 part by weight of a viscosity control agent. Such phenolic resin based adhesives can be used for bonding and bonding various materials such as building materials, for example to form composite materials.
EFFECT: improvement in such properties as strength and rigidity of composite materials obtained using an adhesive material, which at the same time atively light, preservation of structural integrity by substrates under conditions of exposure to high temperatures, a significant reduction or even complete elimination of the catalyst, which, in turn, also helps to improve the thermal and/or fire resistance of both the adhesive material and the material to which the adhesive material is applied.
16 cl, 1 tbl, 6 ex
Authors
Dates
2024-04-08—Published
2019-05-30—Filed