SYSTEM AND METHOD OF MAKING AND ASSEMBLING PACKAGED ELECTRONIC MODULES Russian patent published in 2024 - IPC H05K1/00 H04B1/3816 G06K19/77 

FIELD: electricity.

SUBSTANCE: invention relates to the field of electronic elements used in smart cards, namely to the manufacture of such packaged electronic modules. To this end, a first contact plate is provided, comprising a first electrical connector, which is configured with a first surface of the first contact plate, providing a first printed circuit, comprising a second electrical connector, which is configured with a first surface of the first printed circuit, and connecting the contact plate and the printed circuit so that the first electrical connector and the second electrical connector are electrically coupled to form a packaged electronic module. First printed circuit contains one or more electronic components, and the first electrical connector of the first printed circuit is electrically connected to at least one of the one or more electronic components, and electrical interfacing of the first electrical connector with the second electrical connector forms a gap between the first surface of the first contact plate and the first surface of the first printed circuit. At that, at least one of one or more electronic components is placed in the gap.

EFFECT: reducing the number of steps and time required for the process of manufacturing and/or assembling packaged electronic modules used in smart cards, as well as prevention of damage to electronic components as a result of conjugation of contact plate with printed circuit.

20 cl, 15 dwg