ELECTRONIC MODULE FOR USE WITH SMART CARD AND METHOD OF ITS ASSEMBLY Russian patent published in 2025 - IPC H01L27/14 G06K19/77 

Abstract RU 2833167 C2

FIELD: physics.

SUBSTANCE: present invention represents a packaged electronic module with built-in electronics for use in smart cards. Electronic module for use with smart card comprises at least one integrated circuit chip; contact plate configured with at least one integrated circuit chip; plurality of electronic components connected to at least one integrated circuit chip; and at least one electronic display connected to the plurality of electronic components and/or to at least one integrated circuit chip; electronic module is configured with a card, wherein at least a portion of the contact plate and at least a portion of the at least one electronic display are visible on a first surface of the card; wherein the first part of the electronic module is built into the first surface of the card from the front side of the first surface, and the second part of the electronic module is built into the first surface of the card separately from the first part and from the front side of the first surface, and the parts are connected directly to each other to form a smart card.

EFFECT: invention enables to produce smart cards with built-in electronics.

17 cl, 15 dwg

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RU 2 833 167 C2

Authors

Lalo Cyril

Pochic Sebastien

Essebag Jacques

Dates

2025-01-14Published

2020-03-11Filed