FIELD: machine building.
SUBSTANCE: invention relates to machine building, in particular, to devices for monitoring temperature and vibration of electromechanical equipment. Device consists of a housing with connectors for temperature sensors and vibration sensors. Inside the housing there is a computing device, a printed circuit board connected to the computing device. Printed-circuit board is made with possibility of connection of a power supply unit, thermal sensors and vibration sensors. Computing device is made with possibility of continuous construction of trends of change of temperature value and change of root-mean-square value of vibration velocity and subsequent detection of type of defect of electric machine equipment.
EFFECT: high accuracy of detecting defects in electromechanical equipment.
10 cl, 12 dwg, 5 tbl
