FIELD: chemistry.
SUBSTANCE: invention relates to polymethyl(phenethyl)methylphenylsiloxanes. Disclosed are polymethyl(phenethyl)methylphenylsiloxanes of general formula 1, where m=30-70, n=30-70, m+n=100, x=10-100, which can be used as a base for heat-resistant sealants intended for use in aviation and space engineering, in special machine building and radio electronics, and a method of producing disclosed polymethyl(phenethyl)methylphenylsiloxane polymers.
EFFECT: creation of polysiloxane polymers having higher heat resistance.
2 cl, 3 ex
Formula 1
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0 |
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SU197174A1 |
Authors
Dates
2024-10-04—Published
2023-11-28—Filed