FIELD: chemistry.
SUBSTANCE: invention relates to novel organosilicon compounds for use in heat- and frost-resistant materials. Disclosed are polymethylalkylmethyl(phenetyl)siloxanes of general formula 
, where R=-CH3 or -CH=CH2, m=8-99.97, n=0.03-92, m+n=100, x=1-100. The disclosed compounds are obtained via hydrolytic copolycondensation of dimethyl dichlorosilane, methyl vinyl dichlorosilane and methyl(phenetyl)-dichlorosilane with 20-30% potassium hydroxide (KOH) solution followed by neutralisation and washing the hydrolysate, which is further condensed with hexamethyl trisilazane at 100-150°C for 6-10 hours.
EFFECT: disclosed polymers have high heat-resistance along with good frost-resistance.
1 cl, 4 ex
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