FIELD: chemistry.
SUBSTANCE: invention relates to curing epoxy systems. Disclosed is an epoxy system for use in coatings, adhesives or sealants, comprising epoxy resin and a phenol polymer having number-average molecular weight (Mn) of 200 to 1500 g/mol, including a phenol compound, a binder group L and a terminal group E. Also disclosed is the use of a phenol polymer having a number-average molecular weight (Mn) of 200 to 1500 g/mol, comprising a phenol compound, a binder group L and an end group E as an accelerator for curing epoxy resins, as well as a set of components for use in coatings, adhesives or sealants.
EFFECT: disclosed epoxy system is non-toxic and non-volatile, while having improved curing characteristics.
13 cl, 1 dwg, 28 tbl, 16 ex
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