FIELD: chemistry.
SUBSTANCE: group of inventions relates to a heat-resistant multilayer protective film, a hermetically sealed package, a stable retort package. Heat-resistant multilayer protective film has a substrate layer having thickness of 10 mcm to 100 mcm, an inorganic coating layer and a polymer buffer layer located between the polymer substrate layer and the inorganic coating layer. Polymer buffer layer is in direct contact with the inorganic coating layer, where the inorganic coating layer has a wavy structure characterized by an average amplitude of 0.25 mcm to 1.0 mcm and wavelength of 2 mcm to 5 mcm.
EFFECT: group of inventions provides creation of strong, that is heat-resistant structure of multilayer protective film for package subjected to thermal treatment.
10 cl, 10 dwg, 7 tbl, 14 ex
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Authors
Dates
2025-04-24—Published
2021-09-09—Filed