STRUCTURE OF HEAT-RESISTANT BARRIER FILM Russian patent published in 2024 - IPC B32B27/32 B65D75/58 

Abstract RU 2828495 C2

FIELD: chemistry.

SUBSTANCE: invention relates to structures of heat-resistant multilayer barrier film. Packaging film contains a polyolefin substrate layer having a thickness in range of 10 to 100 mcm, an inorganic coating layer and a polymer buffer layer located between the polyolefin substrate and the inorganic coating layer. Polymer buffer layer is in direct contact with the inorganic coating layer, wherein the inorganic coating layer has a wavy structure characterized by an average amplitude in range of 0.25 to 1.0 mcm and a wavelength in range of 2 to 5 mcm. Also described are packages (for example, hermetically sealed packages) made from barrier packaging film.

EFFECT: preventing formation of cracks in the barrier layer during thermal treatment, which limits loss of oxygen and vapour barrier properties of the film.

35 cl, 12 dwg

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RU 2 828 495 C2

Authors

Okle, Philipp

Lohwasser, Wolfgang

Ettridge, Peter

Christopherson, Roy

Dates

2024-10-14Published

2022-02-11Filed