FIELD: chemistry.
SUBSTANCE: invention relates to structures of heat-resistant multilayer barrier film. Packaging film contains a polyolefin substrate layer having a thickness in range of 10 to 100 mcm, an inorganic coating layer and a polymer buffer layer located between the polyolefin substrate and the inorganic coating layer. Polymer buffer layer is in direct contact with the inorganic coating layer, wherein the inorganic coating layer has a wavy structure characterized by an average amplitude in range of 0.25 to 1.0 mcm and a wavelength in range of 2 to 5 mcm. Also described are packages (for example, hermetically sealed packages) made from barrier packaging film.
EFFECT: preventing formation of cracks in the barrier layer during thermal treatment, which limits loss of oxygen and vapour barrier properties of the film.
35 cl, 12 dwg
Title |
Year |
Author |
Number |
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