FIELD: polymeric glues. SUBSTANCE: glue composition has, wt.-% triethylene glycol dimethacrylate 59-63; methacrylic acid 10-10.5; cumene hydroperoxide 5-5.5; thiourea 1.5-3.0; water 1.5-2.0, and copolymer of butylmethacrylate with methacrylic acid amide 19-20. EFFECT: enhanced working life, glueing strength, resistance, simplified technology. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
GLUE COMPOSITION | 1986 |
|
SU1455706A1 |
POLYMERIC COMPOSITION | 1993 |
|
RU2054022C1 |
METHOD FOR MAKING ADHESIVE SHEET MATERIAL | 0 |
|
SU1028703A1 |
PROCESS OF MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARDS | 1994 |
|
RU2064736C1 |
ADHESIVE COAPOSITION | 0 |
|
SU823406A1 |
ADHESIVE COMPOSITION | 0 |
|
SU1112041A1 |
GLUE | 0 |
|
SU770154A1 |
0 |
|
SU378401A1 | |
ADHESIVE ACRYLIC BASE | 2021 |
|
RU2797121C2 |
ADHESIVE COMPOSITION | 0 |
|
SU1081192A1 |
Authors
Dates
1995-10-27—Published
1986-10-08—Filed