PROCESS OF MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARDS Russian patent published in 1996 - IPC

Abstract RU 2064736 C1

FIELD: electronics, instrumentation engineering. SUBSTANCE: while manufacturing multilayer printed circuit boards one uses cementing spacers (prepregs) prior to assembly of layers in package which are wetted with polymer compositions of hot solidification based on glycol di-ethers of methacrylic acid. Composition is applied in amount of 0.5-40.04 of mass of epoxy binder of spacers. EFFECT: increased quality of printed circuit boards thanks to prevention of interlayer lamination.

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RU 2 064 736 C1

Authors

Urazaev V.G.

Dates

1996-07-27—Published

1994-03-05—Filed